Regis Heat sink Technology Co., Ltd. is a professional manufacturer of heat dissipation processing. Regis's products and services include various heat sinks, structural parts, heat dissipation analysis and heat dissipation scheme design. Our products are widely used in telecommunications, aerospace, automotive, industrial control, power electronics, medical equipment, security electronics, LED lighting and multimedia/consumer fields.
The filler is a highly conductive epoxy resin imported from the United States. When the temperature difference between the two sides of the equipment is not important, the cold plate can be applied to only one or both sides of the equipment. Since the thickness of the copper tube is not affected by any secondary processing, and the safety of the application is guaranteed due to the protection of the filler, this technology is particularly suitable for cold plate applications with refrigerant as the cooling medium.
The production of micro-channel radiators is more complicated than other radiators. Micro-channel radiators are generally used on machines with high heat dissipation power and concentrated heat dissipation. Because of the wider and more uniform water channels, the micro-channel method can quickly take away the concentrated heat. heat. However, the production process of the liquid cooling radiator of the microchannel is also relatively complicated. Generally, the microchannel is machined, and then the friction welding process is used for welding, and the production cost is also high.
This technology is suitable for equipment mounted on one side. The copper tube is deformed by pressing into grooves in the aluminum sheet and then fly-cut on the surface. This removes heat quickly due to the high thermal conductivity of the copper tube. At the same time, the lightweight of aluminum can reduce the total weight and control the cost within a reasonable range.
In the fields of power electronic control, conversion, drive, signal transmission and new energy (new energy vehicle power battery cooling, UPS and energy storage system cooling, large server cooling, large photovoltaic inverter cooling, SVG/SVC cooling, etc.), in order to pursue High efficiency, low noise and low temperature operation, as well as space constraints, heat dissipation has become the maximum limit of ideal product development, and liquid cooling technology has become the preferred thermal management method.
Cold plates provide local cooling by transferring heat from equipment to a liquid that flows to a remote heat exchanger and dissipates to the environment or another liquid in a secondary cooling system.
Liquid cold plates are responsible for transferring heat from surfaces with high thermal loads to the fluids used in liquid cooling systems. The performance of these components is critical to the overall effectiveness of the liquid system.
Cold plates are used in industrial settings primarily to cool electronics and power devices within electric motors; automation controls; large cooling systems such as refrigeration or air conditioning units; boilers and dryers; and machine tools.