Regis Heat sink Technology Co., Ltd. is a professional manufacturer of heat dissipation processing. Regis's products and services include various heat sinks, structural parts, heat dissipation analysis and heat dissipation scheme design. Our products are widely used in telecommunications, aerospace, automotive, industrial control, power electronics, medical equipment, security electronics, LED lighting and multimedia/consumer fields.
This is an excellent heat dissipation material widely used in modern heat dissipation. Most of the industry uses 6063 T5 high-quality aluminum material, its purity can reach more than 98%, its thermal conductivity is strong, its density is low, and its price is cheap, so it has won the praise of major manufacturers. favor. According to the thermal resistance value of Intel and AMD CPU and the consideration of its calorific value, aluminum extrusion manufacturers formulate corresponding molds, heat the aluminum ingots to a certain temperature to change the physical form, and then get out of the mold. We have all kinds of raw materials for heat sinks; we can then use them after cutting, grooving, grinding, deburring, cleaning, and surface treatment.
Today, when the requirements for heat dissipation are constantly increasing, the Japanese have begun to think of using thin and dense heat dissipation fins to fit the heat dissipation bottom plate with huge pressure. This technology can be arbitrarily combined and matched with copper and aluminum fins and copper and aluminum base plates, and also effectively avoids the disadvantage of new thermal resistance caused by uneven heat conduction of various solder pastes during the welding process. It enables customers to have more selectivity and diversity of thermal solutions. However, due to the particularity of its processing, the current mass production still has the problem that the cost is too high.
Although the price of aluminum extruded heat sinks is low and the manufacturing cost is also low, due to the limitation of the soft texture of aluminum itself, the ratio of the thickness of the fins to the height of the fins generally does not exceed 1:18, so each PC manufacturers are constantly increasing the heat dissipation area and keep the heat dissipation space unchanged. The manufacturers have proposed a more suitable solution to encrypt the fins to increase the number of fins; bend the fins to increase the heat dissipation Area; heating the aluminum ingot from a solid state to a liquid state through the mold, and then cooling it becomes the heat sink we want.
After using the aluminum extruded heat sink for such a long time, no matter how we change our processing technology, it is difficult to meet the ever-increasing CPU calorific value. The coefficient is much larger than that of aluminum, and the thermal conductivity is doubled, which is of great benefit to our heat dissipation; however, since the hardness of copper is much greater than that of aluminum, it is a severe test for the manufacturing process during the processing. Therefore, the traditional extrusion molding process is no longer applicable to copper, and has to be processed in this cutting method.
A heat sink is a device that absorbs heat generated by an electronic component or chip. Among different types of heat sinks, two-phase forced convection cooling of high heat flux/high power electronics is one of the most effective thermal management methods.
Active radiators utilize forced air to increase fluid flow through the hot zone. Forced air is most often created by the movement of fans, blowers or even whole objects - for example the engine of a motorcycle is cooled by air from fins designed into the engine.
Radiators are divided into different categories according to different criteria. There are two main types of radiators, active radiators and passive radiators.