In the fields of power electronic control, conversion, drive, signal transmission, and new energy fields (new energy vehicle power battery heat dissipation, UPS and energy storage system heat dissipation, large server heat dissipation, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation Etc.), in order to pursue high-efficiency, low-noise and low-temperature operation, and when space is limited, the heat dissipation problem becomes the biggest limit to the idealization of product development, and liquid cooling technology has become the preferred thermal management method. Can provide a full range of liquid cooling solutions, and provide you with liquid cooling plate/water cooling plate thermal design, structural design, water cooling system assembly design and one-stop supporting services for free.
Buried pipe technology liquid-cooled plates are roughly divided into 4 types. Shallow buried pipe, deep buried pipe, double-sided clamping pipe, soldering or brazing welding pipe technology.
Shallow buried pipe process: Suitable for single-sided installation of devices. After the copper pipe is flattened, it is milled at the same time as the aluminum plate, which fully facilitates the high thermal conductivity of the copper pipe to remove heat, and uses the lightweight aluminum to reduce weight and cost control.
Deep buried pipe process: suitable for packing material imported from the United States with high thermal conductivity epoxy resin. When the temperature difference of the double-sided device is not high, the device can be mounted on single and double sides. Because of the thickness of the copper pipe, no secondary processing is carried out and the packing is protected. It can provide the safety of the application, and is especially suitable for the use of cold plates with refrigerant as the medium.
Double-sided pipe clamping process: suitable for two-sided installation of devices, simple process and low cost; double-sided aluminum plate + aluminum tube & copper tube & stainless steel tube.
Welded pipe process: suitable for copper plate + copper pipe or aluminum plate as the material conversion + copper pipe method, so as to reduce the thickness of the plate and reduce the weight. Since the solder is made of metal, the thermal conductivity and thermal resistance will be lower than the epoxy filled process .
Mainly used in industrial automation, power & transmission, medical equipment, new energy transportation, instruments and testing equipment and other industry products.
The following charts are some parameters of the liquid cooling plate that our company can process
Our company is committed to providing global customers with one-stop heat dissipation solutions from thermal design, thermal simulation, mechanical design optimization, production, testing and quality improvement, and customer after-sales service.